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MMIC Substrate with Bond Pads: MMIC_3D

Symbol

Summary

MMIC_3D models a MMIC substrate containing bondpads and a backside coating for mounting purposes.

This element is for use in 3D EM documents only. See “Using 3D EM Elements ” for details on using 3D pCells with Cadence® AWR® Analyst™ 3D FEM EM analysis software.

Topology

Parameters

Name Description Unit Type Default
ID Subcircuit ID Text S1
NET Subcircuit name Text "MMIC_3D"
*M Multiplicity factor - not used for this model   1
SubWidth Width of the MMIC substrate defined along y-axis Length 1 mm
SubLen Length of the MMIC substrate defined along x-axis Length 1.2 mm
SubThick Thickness of the MMIC substrate defined along z-axis Length 0.1 mm
BackThick Thickness of the backside coating of the MMIC substrate Length 0.005 mm
PadWidth Width of the bondpad mounted on the MMIC substrate Length 0.15 mm
PadLen Length of the bondpad mounted on the MMIC substrate Length 0.1 mm
PadThick Thickness of the bondpad mounted on the MMIC substrate Length 0.005 mm
PadInset Distance between the edge of the MMIC substrate and the edge of the bondpad Length 0.045 mm
Er Relative dielectric constant of MMIC substrate   12.9
TanD Loss tangent of MMIC substrate   0.0004
Rho Bulk resistivity relative to gold of bondpad and backside coating   1

* indicates a secondary parameter

Parameter Details

Er. The permittivity of the insulator material relative to the permittivity of free space, where ε0 = 8.854 x 10-12 F/m.

Rho. The bulk resistivity of conductor metal normalized to gold, where Rho_Gold=2.44 x 10-8 Ω*m. So actual bulk resistivity of conductor metal is (Rho·2.44 x 10-8) Ω*m.

Layout

The 2D projection of this element in the x/y plane displays in EM Layout View.

3D EM Layout

This element is specifically used for Analyst 3D EM layouts. See “Using 3D EM Elements ” for details on using 3D parts with Analyst software.

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