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Multiplate Chip Capacitor - 3D EM Cell: CHCAP2_EM



CHCAP2_EM is a dynamic model of a multiplate ceramic chip capacitor. You can specify the number of interdigitally stacked metal plates, arrange plates and select dielectric properties, and set size and properties of contact pads.

This element is for use in 3D EM documents only. It is intended to create a 3D parameterized cell for a multiplate chip capacitor for 3D EM analysis. See “Using 3D EM Elements ” for details on using 3D pCells with Cadence® AWR® Analyst™ 3D FEM EM analysis software.



Name Description Unit Type Default
ID Element ID Text IC1
N Number of plates   5
L Length of plates (less contact thickness) Length 2 mm
W Width of plates Length 2 mm
WG Interdigital gap between plate tip and side contact Length 0.1 mm
MG Plate side recess into capacitor Length 0.08 mm
D Thickness of dielectric layers Length 0.2 mm
T Plate thickness Length 0.02 mm
Rho Plate metal bulk resistivity relative to gold   1.0
Er Relative dielectric constant of filling dielectric   10
Tand Loss tangent of filling dielectric   1e-4
LC Length of contact pad Length 0.3 mm
TC Thickness of contact pad Length 0.1 mm
Rho Contact pad metal bulk resistivity relative to gold   1.0
*DIE_NAME Filling dielectric name for 3D EM cell   ""

* indicates a secondary parameter

Parameter Details

N. Specifies the total number of interdigitally stacked plates.

L. Specifies the length of the capacitor (thickness of side contacts excluded), (see the "Topology" section).

WG. Specifies the interdigital gap between the plate end and the side contact (see the "Topology" section).

MG. Specifies the recess of the plate side into the dielectric (see the "Topology" section).

Parameter Restrictions and Recommendations

  1. The number of dielectric layers inside the capacitor is N+1. A metal plate sits on top of each layer (except the top layer). Half of the plates connect to the left contact pad; the rest of the plates connects to the right contact pad.

  2. The total length of contact pads 2*LC cannot be greater than 0.95*L.

  3. A 3D cell sets the lower cap on T and TC values equal to 0.1 micron.

  4. The DIE_NAME (hidden) parameter may be used to assign different dielectric materials to multiple instances of CHCAP2_EM.


The layout for this cell has hard-coded model layers. When you first use this layout cell, a layer named "CHCAP2_EM" is added to your drawing layer and model layer list (if they are not already there). Using the model layer mapping, you can assign these layers to draw on any drawing layer.

3D EM Layout

This element has a layout cell specifically for Analyst 3D EM layouts. See “Using 3D EM Elements ” for details on using 3D pCells with Analyst software.

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