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Balanced Stripline Substrate Definition: SSUB

Symbol

Topology

Parameters

Name Description Unit Type Default
Er Relative dielectric constant   Er[1]
B Substrate thickness Length H[1]
T Conductor thickness Length T[1]
Rho Metal bulk resistivity normalized to copper   Rho[1]
Tand Loss tangent of dielectric   0
Name Substrate name Text SUB

[1] User-modifiable default. Modify by editing under $DEFAULT_VALUES in the default.lpf file in the root installation directory.

Implementation Details

Er is the permittivity of the substrate material relative to the permittivity of free space ε0 = 8.854 x 10-12 F/M

Tand is the dielectric loss tangent of the substrate material: Tand = εr″/εr′ where εr = εr′ -jεr

Rho is the bulk resistivity of conductor metal normalized to copper (to 1.7 x 10 -8 Ω*m)

Actual metal bulk resistivity = Rho*1.7 x 10 -8 Ω*m.

B and T are cross sectional dimensional variables given in default length units.

In a schematic that contains stripline elements, at least one instance of this element must exist. The Name parameter provides a unique identifier for each instance of SSUB. The stripline elements have a SSUB parameter that indicates which SSUB element to use.

Note that you can also add this substrate to the Global Definitions window and then reference the material from any schematic.

Layout

This element does not have an assigned layout cell. You can assign artwork cells to any element. See “Assigning Artwork Cells to Layout of Schematic Elements” for details.

Elements used with SSUB

BENDS COMPONENTS JUNCTIONS LINES
SBEND SICAP SCROS SLEF
SCURVE SICAP1 SSTEP SLIN
SMITER SICAP2 SSTEPO STAPER
    SSTEP2 SLSC
    STEE SCTRACE

OTHER OBSOLETE COUPLED LINES
SGAP SLOC SCLIN
SHOLE    

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